Allegro - 產生鑽孔表

(1). 選擇"Manufacture" > "NC" > "Drill Legend..."。

(2). 直接點選"OK"。

(3). 在"Options"視窗中，
Active Class and Subclass:
Manufacturing
Ncdrill_Legend
將鑽孔表擺放至電路板旁。

(4). 在轉出Gerber時，增加"MANUFACTURING/NCLEGEND-1-2"，這樣才可以將鑽孔表增加到Gerber file中。

Allegro - 儲存設定好的Gerber檔案文件與載入

(1). 設定完成Gerber檔案文件後，使用"滑鼠左鍵"點選任一個文件夾，按"滑鼠右鍵"點選"Save All Checked"，可以在狀態欄中看見存檔的檔名。

(2). 之後如果需要重新產生Gerber，可以按"Add..."，選擇""FILM_SETUP.txt"檔，載入之前設定好的Gerber檔案文件。

Allegro - DRC錯誤碼

單一字元碼	相關物件	意義
L	Line	走線
P	Pin	元件腳位
V	Via	貫穿孔
K	Keep in/out	允許區域/禁止區域
C	Component	元件層級
E	Electrical Constraint	電氣約束
J	T-Junction	呈現T形的走線
I	Island Form	被Pin或Via圍成的負片孤銅

錯誤碼前置碼	相關物件	意義
W	Wire	與走線相關的錯誤
D	Design	與整個電路板相關的錯誤
M	Soldemask	與防焊層相關的錯誤

錯誤碼後置碼	相關物件	意義
S	Shape/Stub	與走線層的Shape或分支相關的錯誤
N	Not  Allowed	與不允許的設置相關的錯誤
W	Width	與寬度相關的錯誤

雙字元錯誤碼	相關物件	意義
BB	Bondpad to Bondpad	Bondpad之間的錯誤
BL	Bondpad to Line	Bondpad與Line之間的錯誤
BS	Bondpad to Shape	Bondpad與Shape 之間的錯誤
CC	Package to Package	Package之間的 Spacing 錯誤
CC	Symbol Soldermask to Symbol	Soldermask零件防焊層之間的Spacing 錯誤
DF	Differential Pair Length Tolerance	差動訊號走線的長度誤差過長
DF	Differential Pair Primary Max Separation	差動訊號走線的主要距離太大
DF	Differential Pair Secondary Max Separation	差動訊號走線的次要距離太大
DF	Differential Pair Secondary Max Length	差動訊號走線的次要距離長度過長
DI	Design Constraint Negative Plane Island	負片孤銅的錯誤
ED	Propagation-Delay	走線的長度錯誤
ED	Relative-Propagation-Delay	走線的等長錯誤
EL	Max Exposed Length	走線在外層（TOP&BOTTOM）的長度過長
EP	Max Net Parallelism Length-Distance Pair	已超過Net之間的平行長度
ES	Max Stub Length	走線的分支過長
ET	Electrical Topology	走線連接方式的錯誤
EV	Max Via Count	已超過走線使用的VIA的最大數目
EX	Max Crosstalk	已超過Crosstalk值
EX	Max Peak Crosstalk	已超過Peak Crosstalk值
HH	Hold to Hold Spacing	鑽孔之間的距離太近
HW	Diagonal Wire to Hold Spacing	斜線與鑽孔之間的距離太近
HW	Hold to Orthogonal Wire Spacing	鑽孔與垂直/水平線之間的距離太近
IM	Impedance Constraint	走線的阻抗值錯誤
JN	T Junction Not Allowed	走線呈T形的錯誤
KB	Route Keepin  to Bondpad	Bondpad在Keepin之外
KB	Route keepout  to Bondpad	Bondpad在keepout之內
KB	Via Keepout  to  Bondpad	Bondpad在Via Keepout之內
KC	Package to Place Keepin Spacing	元件在Place Keepin之外
KC	Package to Place Keepout Spacing	元件在Place Keepout之內
KL	Line to Route Keepin Spacing	走線在Route Keepin之外
KL	Line to Route Keepout Spacing	走線在Route Keepout之內
KS	Shape to Route Keepin Spacing	Shape在Route Keepin之外
KS	Shape to Route Keepout Spacing	Shape在Route Keepout之內
KV	BBVia to Route Keepin Spacing	BBVia在Route Keepin之外
KV	BBVia to Route Keepout Spacing	BBVia在Route Keepout之內
KV	BBVia to Via Keepout Spacing	BBVia在Via Keepout之內
KV	Test Via to Route Keepin Spacing	Test Via在Route Keepin之外
KV	Test Via to Route Keepout Spacing	Test Via在Route Keepout之內
KV	Test Via to Via Keepout Spacing	Test Via在Via Keepout之內
KV	Through Via to Route Keepin Spacing	Through Via在Route Keepin之外
KV	Through Via to Route Keepout Spacing	Through Via在Route Keepout之內
KV	Through Via to Via Keepout Spacing	Through Via在Via Keepout之內
LB	Min Self Crossing Loopback Length	無
LL	Line to Line Spacing	走線之間太近
LS	Line to Shape Spacing	走線與Shape 太近
LW	Min Line Width	走線的寬度太細
LW	Min Neck Width	走線變細的寬度太細
MA	Soldermask Alignment Error Pad	Soldermask Tolerance太小
MC	Pin/Via Soldermask to Symbol Soldermask	Pad與Symbol Soldermask之間的錯誤
MM	Pin/Via Soldermask to Pin/Via Soldermask	Pad  Soldermask之間的錯誤
PB	Pin to Bondpad	Pin與Bondpad之間的錯誤
PL	Line to SMD Pin Spacing	走線與SMD元件腳太近
PL	Line to Test Pin Spacing	走線與Test元件腳太近
PL	Line to Through Pin Spacing	走線與Through元件腳太近
PP	SMD Pin to SMD Pin Spacing	SMD元件腳與SMD元件腳太近
PP	SMD Pin to Test Pin Spacing	SMD元件腳與Test元件腳太近
PP	Test Pin to Test Pin Spacing	Test元件腳與Test元件腳太近
PP	Test Pin to Through Pin Spacing	Test元件腳與Through元件腳太近
PP	Through Pin to SMD Pin Spacing	Through元件腳與SMD元件腳太近
PP	Through Pin to Through Pin Spacing	Through元件腳與Through元件腳太近
PS	Shape to SMD Pin Spacing	Shape與SMD元件腳太近
PS	Shape to Test Pin Spacing	Shape與Test元件腳太近
PS	Through Pin to Shape Spacing	Through元件腳與Shape太近
PV	BBVia to SMD Pin Spacing	BBVia與SMD元件腳太近
PV	BBVia to Test Pin Spacing	BBVia與Test元件腳太近
PV	BBVia to Through Pin Spacing	BBVia 與Through元件腳太近
PV	SMD Pin to Test Via Spacing	SMD Pin與Test Via太近
PV	SMD Pin to Through Via Spacing	SMD Pin與Through Via太近
PV	Test Pin to Test Via Spacing	Test Pin與Test Via太近
PV	Test Pin to Through Via Spacing	Test Pin與Through Via太近
PV	Test Via to Through Pin Spacing	Test Via與Through Pin太近
PV	Through Pin to Through Via Spacing	Through Pin與Through Via太近
RC	Package to Hard Room	元件在其他的Room之內
RE	Min Length Route End Segment at 135Degree	無
RE	Min Length Route End Segment at 45/90Degree	無
SB	135Degree Turn to Adjacent Crossing Distance	無
SB	90Degree Turn to Adjacent Crossing Distance	無
SL	Min Length Wire Segment	無
SL	Min Length Single Segment Wire	無
SN	Allow on Etch Subclass	允許在走線層上
SO	Segment Orientaion	無
BB	Bondpad to Bondpad	Bondpad之間的錯誤
SS	Shape to Shape	Shape之間的錯誤
TA	Max Turn Angle	無
VB	Via to Bondpad	Via 與Bondpad之間的錯誤
VG	Max BB Via Stagger Distance	同一段線的BB Via之間的距離太長
VG	Min BB Via Gap	BB Via之間太近
VG	Min BB Via Stagger Distance	同一段線的BB Via之間的距離太近
VG	Pad/Pad Direct Connect	Pad 在另一個Pad 之上
VL	BB Via to Line Spacing	BB Via與走線太近
VL	Line to Through Via Spacing	走線與Through Via太近
VL	Line to Test Via Spacing	走線與Test Via太近
VS	BB Via to Shape Spacing	BB Via與Shape太近
VS	Shape to Test Via Spacing	Shape 與Test Via太近
VS	Shape to Through Via Spacing	Shape與Through Via太近
VV	BB Via to BB Via  Spacing	BB Via之間太近
VV	BB Via to Test Via Spacing	BB Via與Test Via太近
VV	BB Via to Through Via Spacing	BB Via與Through Via太近
VV	Test Via to Test Via Spacing	Test Via之間太近
VV	Test Via to Through Via Spacing	Test Via與Through Via太近
VV	Through Via to Through Via Spacing	Through Via之間太近
WA	Min Bonding Wire Length	Bonding Wire 長度太短
WE	Min End Segment Length	無
WE	Min Length Wire End Segment at 135Degree	無
WE	Min Length Wire End Segment at 45/90Degree	無
WI	Max Bonding Wire Length	Bonding Wire 長度太長
WW	Diagonal Wire to Diagonal Wire Spacing	斜線之間太近
WW	Diagonal Wire to Orthogonal Wire Spacing	斜線與垂直/水平線之間的距離太近
WW	Orthogonal Wire to Orthogonal Wire Spacing	垂直/水平線之間的距離太近
WX	Max Number of Crossing	無
WX	Min Distance between Crossing	無
XB	135 Degree Turn to Adjacent Crossing Distance	無
XB	90 Degree Turn to Adjacent Crossing Distance	無
XD	Externally Determined Violation	無
XS	Crossing to Adjacent Segment Distances	無